3D01600 - SEMI 3D16 - Specification for Glass Base Material for Semiconductor Packaging StdPbc-1122 6-0421 (technical revision)

6-0421 (technical revision)

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The purpose of this Document is to provide a guide for cyclopentanone for which a need has been identified

3D01600 - SEMI 3D16 - Specification for Glass Base Material for Semiconductor Packaging StdPbc-1122 6-0421 (technical revision)This Specification is intended to address the needs of the 3D Stacked IC (3DS IC) industry by providing the tools needed to procure glass as base material to be used in a 3DS IC process or in similar applications. Such glass may be specified with or without openings for through glass vias (TGV) or blind vias (BV). This Specification describes dimensional and thermal characteristics of glass base material for interposers, RF devices, and other similar